Another Horse Ridge or Just Horse Feathers from the Management Icon Intel?
December 20, 2024
This write up emerged from the dinobaby’s own mind. No AI was used because this dinobaby is too stupid to make it work.
If you are an Intel trivia buff, you will know the answer to this question: “What was the name of the 2019 cryogenic control chip Intel rolled out for quantum computers?” The answer? Horse Ridge. And there was a Horse Ridge II a few months later. I am not sure what happened to Horse Ridge. Maybe it was as I suggested horse feathers?
A rider on the Horse Ridge Trail. Notice that where the horse goes, the sagebrush and prairie dogs burn. Thanks, Magic Studio. Good enough.
Intel is back with another big time announcement. I assume this is PR’s way of neutralizing the governance wackiness in evidence at the company. Is there a president? Is there a Horse Ridge?
I read “Intel Looks Beyond Silicon, Outlines Breakthroughs in Atomically-Thin 2D Transistors, Chip Packaging, and Interconnects at IEDM 2024.” The write up reports via information directly from the really well managed outfit the following:
…the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology, among others.
This news will definitely push these type of stories out of the news cycle. This one is from CNN via MSN.com:
Ousted Intel CEO Pat Gelsinger Is Leaving the Company with Millions
I thought that Intel was going to
create great CPUs and super duper graphics cards. (Have you ever test an Intel graphics card? Have you ever tried to find current drivers? Have you dumped it because an Nvidia 3060 is faster and more stable for basic office tasks? I have.
Intel breakthroughs via the cited article and Intel Foundry.
The write up says:
Intel hasn’t shared the deep dive details of its Subtractive Ruthenium process, but we’re sure to learn more details during the presentation. Intel says its Subtractive Ruthenium process with airgaps provides up to 25% capacitance at matched resistance at sub-25nm pitches (the center-to-center distance between interconnect lines). Intel says its research team “was first to demonstrate, in R&D test vehicles, a practical, cost-efficient and high-volume manufacturing compatible subtractive Ru integrated process with airgaps that does not require expensive lithographic airgap exclusion zones around vias, or self-aligned via flows that require selective etches.”
Is there a fungible product? Nope. But technical papers are coming real soon.
Stephen E Arnold, December 20, 2024
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